In advanced materials engineering, N‑phenylmaleimide (N‑PMI) manuafctured by Yangchen Tech has emerged as a high‑performance monomer for imparting exceptional heat resistance, dimensional stability, and mechanical robustness to a wide range of polymer composites. By introducing a rigid five‑membered maleimide ring with a phenyl substituent, N‑PMI elevates thermal decomposition thresholds, raises Vicat softening points, and improves tensile and flexural properties across ABS, PVC, Nylon 6, epoxy, and polyimide systems. 

 

 

Why choose N‑Phenylmaleimide?

N‑Phenylmaleimide features a planar cyclic imide core that resists chain scission at elevated temperatures, pushing onset decomposition temperatures 20–30 °C higher than conventional styrenic copolymers . Its phenyl ring further imparts steric hindrance, reducing segmental mobility and boosting glass transition temperatures (Tg) by up to 15 °C in polymer blends .

 

Specification

 

Appearance	Melting point	Purity	Solubility
Yellow crystalline powder or flakes	85-90℃	＞99%	Soluble in organic solvents   Basic Information     Chemical Structure Chemical Formula C10H7NO2 CAS No. 941-69-5 Molecular Weight 173.16 Packing Type Paper bag (20 kg) Properties Yellow crystalline powder or needles   Core Applications in Polymer Composites   ABS Composites   In ABShttps://www.yangchentech.comNSM (N‑PMI‑styrene‑maleic anhydride) terpolymers, just 10 wt % N‑PMI elevates heat distortion temperatures (HDT) from ~100 °C to 130 °C, while also increasing tensile strength by 10–15 % and Rockwell hardness by 20 % . Such improvements enable under‑the‑hood automotive parts to maintain dimensional integrity under prolonged high‑temperature exposure .   PVC & PMMA Systems   In PVC‑ABS blends, N‑PMI acts as both a heat‑stabilizer and flame‑retardant, helping formulations meet UL‑94 V‑0 ratings by reducing thermal oxidation and dripping under fire tests .Similarly, incorporating 5–15 wt % N‑PMI in PMMA raises Vicat softening points by 10–20 °C, enhancing optical disc substrates and lighting components for sustained high‑temperature service.   Epoxy & Electronics   When used in epoxy formulations, N‑PMI enhances chemical resistance and reduces warpage under thermal cycling, crucial for printed circuit board encapsulation and high‑power electronics housings. Its inherent flame‑retardancy also helps systems achieve UL‑94 V‑0 compliance without halogenated additives.   Mechanisms of Heat‑Resistance Enhancement   1. Rigid Segments & Cross‑Linking: The maleimide ring creates localized rigidity and potential crosslinks that impede chain mobility, directly lifting glass transition and Vicat points. 2. Thermal Decomposition Delay: Steric hindrance from the phenyl substituent raises the onset of thermal degradation by 20–30 °C, as shown in TGA curves where N‑PMI copolymers retain >90 % mass at 300 °C .   3. Flame Retardancy: The cyclic imide structure promotes char formation and limits dripping, underpinning UL‑94 V‑0 ratings in PVC and epoxy systems . Welcome Inquiry!