With the rapid development of 5G communications, artificial intelligence (AI), electric vehicles (EVs), and power electronics, traditional thermal management materials (such as aluminum oxide, Al₂O₃) can no longer meet the demands of high-power, high-frequency, and high-temperature environments. Aluminum nitride (AlN), with its ultra-high thermal conductivity, excellent electrical insulation, and low thermal expansion coefficient, is quickly becoming a critical material in the semiconductor and electronics industries.

So, why is aluminum nitride regarded as a core material for the future of the electronics industry? How does it address the thermal challenges of modern electronic devices? This article will delve into the advantages and applications of AlN.

1. Core Advantages of Aluminum Nitride (AlN)

(1) Ultra-High Thermal Conductivity (170-230 W/m·K)

Traditional aluminum oxide (Al₂O₃) has a thermal conductivity of only 20-30 W/m·K, while AlN’s thermal conductivity is over 7 times higher, approaching that of metallic aluminum (237 W/m·K), yet it retains excellent insulation properties.

It is ideal for high-power semiconductors (e.g., SiC/GaN devices), significantly reducing chip junction temperatures and extending device lifespan.

(2) Low Thermal Expansion Coefficient (4.5×10⁻⁶/K), Matches Silicon Chips

AlN’s thermal expansion coefficient is close to that of silicon (Si, ~3.5×10⁻⁶/K), minimizing thermal cycling stress and preventing chip cracking.

It performs exceptionally well in high-density integrated circuit (IC) packaging, improving reliability.

(3) Excellent Electrical Insulation (Resistivity >10¹⁴ Ω·cm)

Suitable for high-voltage, high-frequency electronic devices (e.g., 5G base stations, radar systems), preventing current leakage.

(4) High-Temperature Resistance (>2000°C) and Chemical Stability

Ideal for extreme environments such as aerospace and EV battery systems.

2. Applications of AlN in Electronics and Semiconductors

(1) Power Electronics & Electric Vehicles (EVs)

IGBT Modules: Companies like Tesla and BYD use AlN substrates to improve inverter heat dissipation and extend battery life.

SiC/GaN Devices: AlN substrates are used in silicon carbide (SiC) and gallium nitride (GaN) power modules to enhance switching frequency and energy efficiency.

(2) 5G Communications & RF Devices

5G base station power amplifiers (PAs) require efficient heat dissipation; AlN ceramic packaging reduces signal loss and improves transmission efficiency.

Companies like Huawei and Ericsson use AlN substrates to optimize millimeter-wave (mmWave) antenna performance.

(3) LEDs & Laser Diodes

High-brightness LEDs (e.g., UV LEDs, Micro LEDs) rely on AlN substrates for heat dissipation to prevent efficiency degradation.

LiDAR systems use AlN to enhance thermal management, ensuring the stability of autonomous driving sensors.

(4) Aerospace & Defense

Satellite power systems, radar, and electronic warfare equipment require high-temperature-resistant, radiation-hardened materials, making AlN an ideal choice.

Key Drivers:

EV adoption (surge in SiC/GaN demand)

Large-scale deployment of 5G base stations (high-frequency heat dissipation needs)

AI servers & high-performance computing (HPC) (thermal management for high-power chips)

3. Frequently Asked Questions (FAQ)

Q1: AlN is more expensive than Al₂O₃—why is it still worth the investment?

A1: Although AlN has a higher initial cost, its superior thermal conductivity, longer device lifespan, and lower system failure rates reduce long-term costs.

Q2: Is AlN difficult to process?

A2: Modern hot-press sintering (HPS) and precision grinding technologies can achieve ±0.001mm accuracy, meeting the demands of high-end electronic packaging.

Q3: Will AlN be replaced by other materials in the future?

A3: In the high-thermal-conductivity ceramic field, AlN currently offers the best balance (thermal conductivity, insulation, cost). Future developments may involve composite ceramics (e.g., AlN-SiC), but AlN will remain a core material.

4. Conclusion: Aluminum Nitride—The Future Material for Electronics

AlN, with its exceptional thermal conductivity, electrical insulation, and thermal matching properties, is driving innovation in semiconductors, 5G communications, EVs, and aerospace. As third-generation semiconductors (SiC/GaN) become mainstream, the demand for AlN will continue to grow.

About Xiamen Juci Technology

Juci Technology leverages high-purity raw materials, advanced composite additives, and precision sintering processes to enable stable mass production of high-performance AlN ceramic substrates. With flexible customization and rigorous quality control, we meet the demanding requirements of high-power LEDs, IGBT modules, 5G RF devices, and aerospace applications—making us a leading Chinese supplier of ultra-high thermal conductivity aluminum nitride solutions.

Media Contact:
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Aluminum nitride (AlN) ceramics exhibit excellent physical properties, including high thermal conductivity, low dielectric constant, high strength, high hardness, non-toxicity, and a thermal expansion coefficient similar to that of silicon. Additionally, they demonstrate outstanding chemical stability and corrosion resistance. AlN-based multilayer co-fired substrates, used as dielectric isolation materials, are ideal for heat dissipation and packaging in high-power modules and large-scale integrated circuits.

I. Manufacturing Process of AlN Co-fired Substrates

The production process of AlN high-temperature co-fired ceramic (HTCC) multilayer substrates involves mixing AlN powder with sintering aids and additives to form a ceramic slurry. This slurry is then shaped into green ceramic sheets via tape casting. Pre-designed circuits are fabricated on these green sheets through processes such as drilling, filling, and printing using metal pastes. The sheets are then laminated and subjected to high-temperature sintering to produce highly thermally conductive and dense ceramic substrates.

Since high-thermal-conductivity AlN ceramics typically require sintering temperatures above 1600°C, conventional precious metal conductors like Pd-Ag or Au are unsuitable for co-firing with AlN. Instead, high-melting-point metals such as tungsten (W, melting point 3400°C) and molybdenum (Mo, melting point 2623°C) are used as co-fired conductors. However, W and Mo pastes exhibit poor solderability, necessitating surface plating with nickel, palladium, and gold to enhance solderability for subsequent assembly. 

High-temperature co-firing is a critical step in manufacturing AlN multilayer ceramic substrates, significantly impacting their flatness, conductor adhesion, and sheet resistance.

II. Application Fields of AlN Co-fired Substrates

AlN multilayer ceramic substrates combine the advantages of traditional multilayer ceramic substrates in 3D integration with superior thermal dissipation capabilities. They enable rapid heat dissipation while increasing packaging density and matching the thermal expansion coefficients of semiconductor materials. These substrates have broad application prospects in high-density, high-power multichip modules (MCMs), LED packaging, optical communication packaging, and MEMS packaging.

Multichip Modules (MCMs)

The advancement of large-scale integrated circuits imposes higher demands on inter-chip interconnections. High-density packaging technologies have become mainstream in high-end electronic systems. MCMs represent an advanced form of microelectronic packaging, integrating bare chips and micro-components onto a high-density wiring substrate to form functional modules or even subsystems. MCMs also facilitate miniaturization and high-density integration of electronic systems, serving as a critical pathway for system integration. High-density multilayer substrate technology is key to achieving high-density packaging in MCMs.

MEMS

MEMS systems integrate sensors, actuators, and control/drive circuits, combining microelectronics and micromechanical technologies. In MEMS, these components are tightly interconnected and mutually influential. The circuitry generates significant heat, while the mechanical components are fragile and prone to damage. Ensuring reliable signal transmission and effective protection between components is crucial, placing higher demands on MEMS packaging technologies.

About Xiamen Juci Technology

Juci Technology leverages high-purity raw materials, advanced composite additives, and precision sintering processes to enable stable mass production of high-performance AlN ceramic substrates. With flexible customization and rigorous quality control, we meet the demanding requirements of high-power LEDs, IGBT modules, 5G RF devices, and aerospace applications—making us a leading domestic supplier of ultra-high thermal conductivity aluminum nitride solutions.

Media Contact:
Xiamen Juci Technology Co., Ltd.

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Email: miki_huang@chinajuci.com

Website: www.jucialnglobal.com

The ocean holds great economic potential, but its harsh environment - high salinity, high humidity, microbial erosion, and wave impact - is constantly testing the durability of offshore infrastructure. Corrosion is one of the most severe and costly challenges facing the marine engineering field. From offshore wind power platforms, port terminals, oil and gas facilities to ships and cross-sea bridges, the invasion of corrosion not only causes huge economic losses, but also directly threatens structural safety and operational continuity. At  AAB Industry Group, we are well aware of these challenges and are committed to providing a full range of marine anti-corrosion solutions that exceed industry standards to ensure that your offshore assets remain new in the blue territory.

Understand the complexity of marine corrosion:

Corrosion in the marine environment is diverse and complex. The following highlights several key corrosion zones and mechanisms:

·Splash Zone: Alternating dry and wet, with sufficient oxygen, is the area with the fastest corrosion rate.

·Submerged Zone: Long-term immersion in seawater, facing uniform corrosion, pitting corrosion, and local corrosion caused by the attachment of marine organisms.

·Tidal Zone: Periodic submergence and exposure, extremely harsh corrosion environment.

·Marine Atmosphere: Salt spray and high humidity cause continuous corrosion on metal surfaces.

·Microbiological Influence Corrosion (MIC): The activity of specific microorganisms accelerates the destruction of metal materials.

·Galvanic Corrosion: Accelerated corrosion caused by potential difference when different metal materials are connected.

The interaction of these factors makes marine corrosion prevention by no means an easy task, which requires systematic scientific design, high-performance materials and exquisite construction technology.

China AAB Industry Technology Group: Your trusted marine anti-corrosion guard

Faced with such complex challenges, China AAB Industry Technology Group provides customized marine anti-corrosion protection with its deep technical accumulation, innovative products and professional engineering services.

We provide a series of rigorously tested and verified high-performance marine anti-corrosion coating raw materials designed for harsh environments, such as fillers, additives, pigments, antifouling agents, etc. Our products have the following characteristics:

·Extraordinary weather resistance and UV resistance: Effectively resist salt spray, moisture and strong sunlight in the marine atmosphere.

·Excellent adhesion and flexibility: Even when the metal expands and contracts or the structure is slightly deformed, it can remain intact to prevent cracking and peeling.

·Extremely low water permeability and air permeability: Form a dense barrier to block the penetration of corrosive media.

·Excellent wear and impact resistance: Resist physical damage such as waves, floating ice, equipment collision, etc.

·Long-term anti-corrosion life: Under strict construction conditions, the design life can reach more than 15 years, significantly reducing maintenance frequency and total cost.

·Customized solutions: We carefully design the optimal coating system (primer, intermediate paint, topcoat) according to the specific environment of the structure (such as splash zone, full immersion zone, atmospheric zone), substrate type (steel, concrete, etc.) and service requirements.

The corrosion power of the ocean should not be underestimated, but it is by no means invincible. Choosing China AAB Industry Technology Group as your partner means choosing scientific, reliable and long-term protection. We not only provide top products and technologies, but also provide professional services and commitments throughout the entire cycle of project design, construction, and operation and maintenance. Let us work together to build an indestructible line of defense for your marine assets with innovative solutions, conquer corrosion challenges, and unleash the unlimited potential of the blue economy.

Take action now:

Visit our website China AAB industry technology group to learn more about our marine anti-corrosion solutions and technical information.

Contact our anti-corrosion experts for free consultation and customized solution recommendations for your specific project. Let our AAB's professional strength protect your offshore investment!

Mr.Bruce

Tel: +86 13951823978(Whatsapp)

Mail:info@aabindustrygroup.com

1 PVA (PVA 088-20 & PVA 1788) water resistance modification

PVA (Polyvinyl alcohol) has very low air permeability and is a high-barrier packaging material with excellent performance. Because the molecular chain contains a large number of hydroxyl groups and has high hydrophilicity, these hydroxyl groups are easy to form hydrogen bonds with water molecules under high humidity, resulting in changes in the aggregate structure of PVA, causing its barrier properties to drop sharply. Therefore, necessary water resistance modification should be carried out on PVA to reduce the effect of humidity on the barrier properties of PVA. The mechanism of PVA water resistance modification is to cross-link PVA by adding a cross-linking agent, and completely or partially block the hydroxyl groups, which can reduce its hydrophilicity and achieve the purpose of improving water resistance. The 8511 Institute of the China Aerospace Corporation has developed a melamine resin modified liquid "868" that has no toxic side effects on the human body. "868" is a multifunctional polycondensate. When the amount added is not large, it can moderately cross-link with the hydroxyl groups in PVA, so that PVA forms a strong three-dimensional structure coating, which determines the air tightness of PVA under wet conditions and improves water resistance. This modified PVA coating liquid will not form a skin at room temperature, will not swell or fall off when in contact with water, and can be used for glue preparation and coating at room temperature.

2 PVA (PVA 100-27 & PVA 1799)water-soluble modification

PVA's water solubility can be used to make water-soluble films. Water-soluble films are a new type of green and environmentally friendly packaging material, which is widely used in the packaging of various products in Europe, America, Japan and other countries. For example, pesticides, fertilizers, pigments, detergents, water treatment agents, concrete additives, detergents, chemical reagents for photography and chemical reagents for gardening care. Because the water solubility of pure PVA film cannot meet the requirement of dissolution time ≤ 300s in water at 20℃, Wen Huojiang et al. carried out Michael addition reaction with PVA and acrylamide, and then hydrolyzed and synthesized modified PVA under base catalysis. Water-soluble anionic groups were introduced into the PVA molecular chain to enhance the solubility. Water-soluble films were prepared using this as raw material, and the relationship between the amount of alkali, acrylamide and modification rate was discussed. The modification rate made a great contribution to the low-temperature rapid solubility of the prepared film within a certain range. The effect on water solubility beyond a certain range was not significant, but it would lead to excessively high costs.

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The US International Trade Commission determined, in accordance with the Tariff Act of 1930, that the revocation of the anti-dumping duty order on certain Polyvinyl Alcohol (PVA) originating in China, Japan and South Korea imported into the United States may cause substantial damage to the US industry. In 2002, Celanese and DuPont launched anti-dumping investigations against the above countries. In 2003, the ITC decided that Japanese imports were a risk for injury, but they left out Germany. They also excluded China's Sichuan Weiye Company because it didn't meet the required standards at the time. On the other hand, they found that Shanghai Volkswagen was indeed dumping. In July and October 2003, the United States officially imposed anti-dumping duties on PVA from China, Japan and South Korea.

ITC clearly defined the "domestic similar products" of polyvinyl alcohol (PVA) in the review. According to the Tariff Act, similar products refer to products that are similar or most similar to the investigated goods in terms of characteristics and uses. The Ministry of Commerce has limited the scope of the investigation to PVA with a degree of hydrolysis exceeding 80%, while excluding 15 specific forms of PVA.

PVA is a water-soluble synthetic polymer in the form of white particles or powders, and its properties are mainly determined by the degree of hydrolysis, viscosity and molecular weight. In terms of production process, PVA is produced by hydrolysis of vinyl acetate monomers under the action of a catalyst after polymerization. In the USA, PVA is captively consumed or sold to end users primarily as an intermediate in the production of PVB, which is a plastic laminate used as an adhesive between panes of automotive safety glass or load-resistant architectural glass.  PVA is also sold to end users (and occasionally to distributors) for use in the textile and paper industries in sizing formulations(such as PVA 098-08 & PVA 1099); as a binder in adhesive and soil binding formulations（such as PVA 088-20 & PVA 1788); and as an emulsion or polymerization aid in colloidal suspensions, water-soluble films, cosmetics, and joint compounds (such as KURARAY POVAL 17-94). 

Although different grades of PVA have differences in specific applications, the committee believes that all PVAs with a degree of hydrolysis exceeding 80% should be considered as the same type of product. This decision is based on three main points: first, all types of PVA share the same basic chemical makeup; second, different grades of PVA can be swapped for each other in many cases; and third, the way they are made and the materials used are pretty similar. It's important to note that while end users tend to stick to one specific grade of PVA to keep costs down, this habit doesn't change the fact that the product itself is quite uniform.

In this review, the Commission stuck with the product definition from the original investigation for two reasons: major manufacturers like Celanese and DuPont agreed with it, and the market hasn’t changed much since then. This decision also continues the Commission's position in the original investigation, that is, not to classify PVB-grade PVA into different product categories.

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Compatibility

The compatibility of Butvar polyvinyl butyral resins (PVB) with various plasticizers, modifiers, and additional resins is extensively documented. Butvar is readily amenable to compounding with other additives to improve its physical and chemical characteristics. Plasticizers are frequently utilized to enhance flexibility across a wider temperature spectrum, as noted in Table 9.

Crosslinking agents, including Santolink phenolic and Resimene amino resins, are employed to provide superior toughness and thermal stability. The compatibility of Butvar polyvinyl butyral resins (Butvar B-98 &  PVB WWW-A-20) with other modifiers and resins is illustrated in Table 10.

Insolubilizing Reactions

Numerous applications of vinyl acetal resins involve curing processes that utilize thermosetting resins to achieve the desired property balance. The free hydroxyl groups present in vinyl acetal resins serve as reactive sites for chemical interaction, allowing for the insolubilization of the resins. Generally, any chemical reagent or resinous material capable of reacting with secondary alcohols will interact with polyvinyl butyral (Butvar B-76 & WWW-A-30) to reduce its solubility. The characteristics of coatings can vary significantly depending on the type and quantity of crosslinking agents employed.

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Polyvinyl Butyral Resin (PVB) resin has become a popular high-performance material in industrial applications due to its excellent adhesion, flexibility and chemical adjustability. Especially in the field of insulating paint and surface coating, its unique hydroxyl active group gives it excellent adhesion, cross-linking ability and compatibility with a variety of resins, which can not only meet the stringent electrical performance requirements, but also provide a strong and durable protective coating. Whether as an insulating coating for electromagnetic wires or as a key component of multifunctional surface coatings, Butvar PVB has demonstrated its cross-domain adaptability and established its long-term leading position in the industry.

Wire enamels

Butvar resins ( Butvar B-98 & PVB WWW-A-20) may be used to overcoat magnet wire so that coils made from that wire can be cemented with heat or by solvent activation. Magnet wire that is coiled or formed, featuring a polyvinyl butyral coating, exhibits significant durability and flexibility. The hydroxyl functional groups within the polyvinyl butyral structure enable it to not only form crosslinks with itself but also to engage in cross-curing with phenolic or isocyanate resins. The comprehensive equilibrium of both physical and chemical characteristics has established Butvar-based overcoats as a predominant choice in the industry for an extended period.

Surface coatings

Butvar resin (Butvar B-76 &  PVB WWW-A-30) can be utilized either independently or in conjunction with various resins to create effective surface coating formulations. Films which may be air dried, baked, or cured at room temperature are obtained by proper compounding. The incorporation of hydroxyl groups within the polymer structure not only facilitates effective wetting of various substrates but also provides a reactive site for chemical interaction with thermosetting resins.

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With the rise and application of power devices, especially third-generation semiconductors, semiconductor devices are gradually evolving toward high power, miniaturization, integration, and multifunctionality. This places higher demands on the performance of packaging substrates. Ceramic substrates, with their high thermal conductivity, excellent heat resistance, low thermal expansion coefficient, high mechanical strength, good insulation, corrosion resistance, and radiation resistance, are widely used in electronic device packaging.

So, between aluminum nitride (AlN) and silicon nitride (Si₃N₄), which is the most promising packaging material?

Requirements for Ceramic Substrate Materials

1、High thermal conductivity to meet heat dissipation needs.

2、Excellent heat resistance for high-temperature applications (above 200°C).

3、Matching thermal expansion coefficient to reduce thermal stress between the chip and substrate.

4、Low dielectric constant for high-frequency performance, reducing signal delay and improving transmission speed.

5、High mechanical strength to withstand mechanical demands during packaging and application.

6、Good corrosion resistance to endure strong acids, alkalis, boiling water, and organic solvents.

7、Dense structure to meet hermetic packaging requirements for electronic devices.

Silicon Nitride (Si₃N₄)

Si₃N₄ ceramic substrates have an elastic modulus of 320 GPa, a flexural strength of 920 MPa, a thermal expansion coefficient of only 3.2 × 10⁻⁶/°C, and a dielectric constant of 9.4. They exhibit high hardness, strength, low thermal expansion, and excellent corrosion resistance.

Initially, due to the complex crystal structure of Si₃N₄, which causes significant phonon scattering, its thermal conductivity was considered low (15–30 W/(m·K)), making it suitable only for applications like bearing balls and structural components. However, research later revealed that the low thermal conductivity was mainly due to lattice defects and impurities, and it was predicted that its theoretical thermal conductivity could reach up to 320 W/(m·K). Subsequent studies optimized the manufacturing process, significantly improving the thermal conductivity of Si₃N₄ ceramics, which has now reached 177 W/(m·K).

Additionally, compared to other ceramic materials, Si₃N₄ exhibits outstanding advantages, particularly in high-temperature environments, where it demonstrates excellent thermal stability, chemical inertness to metals, ultra-high hardness, and fracture toughness. The flexural strength and fracture toughness of Si₃N₄ ceramics are more than twice those of AlN, making Si₃N₄ substrates far superior in reliability.

Aluminum Nitride (AlN)

AlN is one of the few materials that combines high thermal conductivity with excellent electrical insulation.

Its advantages include:

High thermal conductivity—Theoretical thermal conductivity at room temperature can reach up to 320 W/(m·K), 8–10 times that of alumina ceramics. In practice, its thermal conductivity can reach 200 W/(m·K), facilitating heat dissipation in LEDs and improving performance.

Low thermal expansion coefficient—Theoretical value is 4.6 × 10⁻⁶/K, close to that of commonly used LED materials like Si and GaAs. Its thermal expansion behavior is also similar to that of Si. Additionally, AlN has a lattice structure matching that of GaN, which is crucial for high-performance power LEDs.

Wide bandgap (6.2 eV)—Excellent insulation properties eliminate the need for additional insulation treatment in high-power LED applications, simplifying the process.

High hardness and strength—Due to its wurtzite structure and strong covalent bonds, AlN exhibits good mechanical properties. It also has excellent chemical stability and high-temperature resistance, remaining stable in air up to 1000°C and in vacuum up to 1400°C, making it suitable for high-temperature sintering and corrosion-resistant applications.

Conclusion

Among existing ceramic substrate materials, Si₃N₄ has the highest flexural strength and wear resistance, making it the best in terms of comprehensive mechanical properties. Its extremely low thermal expansion coefficient also makes it a highly promising material for power device packaging. However, its complex manufacturing process, high cost, and relatively low thermal conductivity limit its use to applications requiring high strength but moderate heat dissipation.

On the other hand, AlN excels in almost all aspects, particularly in thermal conductivity, which is crucial for electronic packaging. The main drawback is its high cost due to expensive raw materials and processing. However, as AlN production technology advances, costs are expected to decrease, paving the way for widespread adoption in high-power LED applications.

Which material do you think will dominate the future of high-power electronics?

About Xiamen Juci Technology

As the top aluminum nitride (AlN) powder manufacturer in China, Xiamen Juci Technology specializes in high-purity, high-performance AlN materials for advanced electronic applications. Our AlN powder and ceramics deliver exceptional thermal conductivity (up to 200 W/m·K), superior electrical insulation, and outstanding mechanical strength, making them ideal for high-power electronics, semiconductor packaging, LED cooling, and next-generation 5G/EV systems.

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Aluminum nitride (AlN) ceramics are widely used in electronic packaging and heat dissipation due to their excellent thermal conductivity. However, impurities and sintering conditions significantly affect their performance. This article discusses key approaches to improving AlN's thermal conductivity, including powder purification, sintering aids, process optimization, and prolonged sintering.

(1) Controlling the Quality of AlN Powder and Reducing Oxygen Impurity Content

Improving the synthesis method of AlN powder to produce high-purity powder with a particle size below 1 μm and an oxygen content of 1% is a prerequisite for preparing high-thermal-conductivity AlN ceramics. Additionally, for AlN powder containing sintering aids, introducing an appropriate amount of carbon can reduce and carburize the oxides on the AlN powder surface during the sintering process before densification, thereby enhancing the thermal conductivity of AlN ceramics. From this perspective, AlN powder prepared by the carbothermal reduction method may be more conducive to improving the thermal conductivity of AlN ceramics.

(2) Selecting Appropriate Types and Amounts of Sintering Additives

Extensive research has shown that rare-earth metal oxides and fluorides, alkaline-earth metal oxides and fluorides, etc., can serve as sintering aids to improve the thermal conductivity of AlN. Sintering aids react with alumina in AlN to form aluminate liquid phases, facilitating liquid-phase sintering and densification of the green body. On the other hand, sintering aids can reduce the oxygen content in the AlN lattice while enhancing contact between AlN particles, thereby improving thermal conductivity. However, the amount of additives must be appropriate—excessive amounts increase impurity content and impair thermal conductivity, while insufficient amounts fail to serve as effective sintering aids. As mentioned earlier, recent studies have shown that composite additives are more effective than single additives in enhancing thermal conductivity while also lowering the sintering temperature.

The effectiveness of additives in improving thermal conductivity has been confirmed by numerous experiments. Introducing suitable additives is currently a widely adopted method. However, there is no unified conclusion regarding the selection and combination of additives, their optimal amounts, or the methods of addition, necessitating further in-depth and systematic exploration.

(3) Optimizing Sintering Processes

For AlN ceramics, slow heating during sintering is more advantageous than rapid heating, as it not only reduces deformation but also improves the densification of the green body, thereby enhancing the performance of AlN ceramics.

The sintering process also involves an optimal sintering temperature. If the temperature is too high, excessive grain growth occurs, the grain boundary phase increases, and densification decreases, negatively impacting thermal conductivity.

Appropriately extending the sintering time can further purify the crystal lattice, promote grain growth, and significantly reduce porosity, thereby increasing thermal conductivity.

Generally, sintering in a reducing atmosphere under nitrogen protection can reduce oxygen impurities in AlN through carbothermal nitridation and reduction, which is beneficial for improving thermal conductivity. Pressure sintering significantly enhances the sintering performance of AlN and reduces the amount of sintering aids required. Increasing pressure improves the densification of AlN, all of which contribute to better performance of AlN ceramics. Additionally, the powder-bed method also affects the thermal conductivity of AlN ceramics.

(4) Prolonging Sintering Time

In addition to introducing sintering aids and optimizing sintering processes, extending the sintering time can also improve the thermal conductivity of AlN ceramics. For example, annealing in a reducing atmosphere can remove oxygen and secondary phases from AlN. Nakano et al. used a similar method, heat-treating sintered AlN (with Y₂O₃) in a reducing nitrogen atmosphere at 1900°C. After 20 hours, the thermal conductivity reached 220 W/m·K, and after 100 hours, it increased to 272 W/m·K.

About Xiamen Juci Technology

Juci Technology, with its high-purity raw materials, composite additive technology, precise sintering process and flexible customization capabilities, has become one of the few domestic enterprises capable of stably mass-producing high thermal conductivity AlN ceramics, especially suitable for the demands of high-end fields such as high-power leds, IGBT modules and aerospace.

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Aluminum Nitride (AlN) possesses a series of excellent properties, with its core advantages including outstanding thermal conductivity, reliable electrical insulation, and a thermal expansion coefficient that matches silicon. In which fields can it be applied?

1、Heat Dissipation Substrates and Electronic Device Packaging

Heat dissipation substrates and electronic device packaging are the primary applications of AlN ceramics. AlN ceramics exhibit exceptional thermal conductivity, a thermal expansion coefficient close to that of silicon, high mechanical strength, good chemical stability, and are environmentally non-toxic. They are regarded as ideal materials for the next generation of heat dissipation substrates and electronic device packaging. They are particularly suitable for hybrid power switch packaging, microwave vacuum tube encapsulation shell materials, and are also an ideal substrate material for large-scale integrated circuits.

2、Structural Ceramics

A common application of structural ceramics is in electrostatic chucks for wafer processing. AlN structural ceramics offer excellent mechanical properties, high hardness, and better toughness than Al₂O₃ ceramics, along with high-temperature and corrosion resistance. Leveraging AlN's heat and erosion resistance, it can be used to manufacture high-temperature corrosion-resistant components such as crucibles, Al evaporation dishes, and semiconductor electrostatic chucks.

3、Functional Materials

AlN can be used to produce high-frequency, high-power devices capable of operating in high-temperature or radiation-prone environments, such as high-power electronic devices and high-density solid-state memory. As one of the third-generation semiconductor materials, AlN boasts a wide bandgap, high thermal conductivity, high resistivity, excellent UV transmittance, and high breakdown field strength.

With a bandgap of 6.2 eV and strong polarization effects, AlN finds applications in mechanical, microelectronic, optical, and surface acoustic wave (SAW) device manufacturing, as well as high-frequency broadband communication. Examples include AlN piezoelectric ceramics and thin films. Additionally, high-purity AlN ceramics are transparent, offering excellent optical properties. Combined with their electrical properties, they can be used to create functional devices such as infrared radomes and sensors.

4、Inert Heat-Resistant Materials

As a heat-resistant material, AlN can be used for crucibles, protective tubes, casting molds, and more. AlN remains stable in non-oxidizing atmospheres up to 2000°C, making it an excellent high-temperature refractory material with strong resistance to molten metal erosion.

5、Heat Exchange Components

AlN ceramics feature high thermal conductivity, low thermal expansion coefficient, and excellent thermal efficiency and thermal shock resistance, making them ideal materials for heat exchange and thermal shock resistance. For example, AlN ceramics can serve as heat exchanger materials for marine gas turbines and heat-resistant components in internal combustion engines. The superior thermal conductivity of AlN materials significantly enhances the heat transfer efficiency of heat exchangers.

6、Filler Materials

AlN exhibits excellent electrical insulation, high thermal conductivity, good dielectric properties, and compatibility with polymer materials, making it an outstanding additive for electronic polymer materials. It can be used as a filler for thermal interface materials (TIM) and flexible copper-clad laminate (FCCL) dielectric layers, widely applied as a thermal transfer medium in electronic devices to improve efficiency. Examples include filling gaps between CPUs and heat sinks, or acting as a thermal transfer medium in the fine gaps between high-power transistors, thyristors, and substrates.

About Xiamen Juci Technology

Xiamen Juci Technology is the leading AlN powder manufacture in China. Our  AlN products feature excellent thermal conductivity, electrical insulation, and mechanical strength, widely used in electronic packaging, semiconductors, LED heat dissipation, and other fields. Juci Technology specializes in manufacturing high-performance aluminum nitride heat sinks and aluminum nitride ceramic substrates, providing leading solutions for electronic heat dissipation.

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Xiamen Juci Technology Co., Ltd.

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