1 PVA (PVA 088-20 & PVA 1788) water resistance modification

PVA (Polyvinyl alcohol) has very low air permeability and is a high-barrier packaging material with excellent performance. Because the molecular chain contains a large number of hydroxyl groups and has high hydrophilicity, these hydroxyl groups are easy to form hydrogen bonds with water molecules under high humidity, resulting in changes in the aggregate structure of PVA, causing its barrier properties to drop sharply. Therefore, necessary water resistance modification should be carried out on PVA to reduce the effect of humidity on the barrier properties of PVA. The mechanism of PVA water resistance modification is to cross-link PVA by adding a cross-linking agent, and completely or partially block the hydroxyl groups, which can reduce its hydrophilicity and achieve the purpose of improving water resistance. The 8511 Institute of the China Aerospace Corporation has developed a melamine resin modified liquid "868" that has no toxic side effects on the human body. "868" is a multifunctional polycondensate. When the amount added is not large, it can moderately cross-link with the hydroxyl groups in PVA, so that PVA forms a strong three-dimensional structure coating, which determines the air tightness of PVA under wet conditions and improves water resistance. This modified PVA coating liquid will not form a skin at room temperature, will not swell or fall off when in contact with water, and can be used for glue preparation and coating at room temperature.

2 PVA (PVA 100-27 & PVA 1799)water-soluble modification

PVA's water solubility can be used to make water-soluble films. Water-soluble films are a new type of green and environmentally friendly packaging material, which is widely used in the packaging of various products in Europe, America, Japan and other countries. For example, pesticides, fertilizers, pigments, detergents, water treatment agents, concrete additives, detergents, chemical reagents for photography and chemical reagents for gardening care. Because the water solubility of pure PVA film cannot meet the requirement of dissolution time ≤ 300s in water at 20℃, Wen Huojiang et al. carried out Michael addition reaction with PVA and acrylamide, and then hydrolyzed and synthesized modified PVA under base catalysis. Water-soluble anionic groups were introduced into the PVA molecular chain to enhance the solubility. Water-soluble films were prepared using this as raw material, and the relationship between the amount of alkali, acrylamide and modification rate was discussed. The modification rate made a great contribution to the low-temperature rapid solubility of the prepared film within a certain range. The effect on water solubility beyond a certain range was not significant, but it would lead to excessively high costs.

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The US International Trade Commission determined, in accordance with the Tariff Act of 1930, that the revocation of the anti-dumping duty order on certain Polyvinyl Alcohol (PVA) originating in China, Japan and South Korea imported into the United States may cause substantial damage to the US industry. In 2002, Celanese and DuPont launched anti-dumping investigations against the above countries. In 2003, the ITC decided that Japanese imports were a risk for injury, but they left out Germany. They also excluded China's Sichuan Weiye Company because it didn't meet the required standards at the time. On the other hand, they found that Shanghai Volkswagen was indeed dumping. In July and October 2003, the United States officially imposed anti-dumping duties on PVA from China, Japan and South Korea.

ITC clearly defined the "domestic similar products" of polyvinyl alcohol (PVA) in the review. According to the Tariff Act, similar products refer to products that are similar or most similar to the investigated goods in terms of characteristics and uses. The Ministry of Commerce has limited the scope of the investigation to PVA with a degree of hydrolysis exceeding 80%, while excluding 15 specific forms of PVA.

PVA is a water-soluble synthetic polymer in the form of white particles or powders, and its properties are mainly determined by the degree of hydrolysis, viscosity and molecular weight. In terms of production process, PVA is produced by hydrolysis of vinyl acetate monomers under the action of a catalyst after polymerization. In the USA, PVA is captively consumed or sold to end users primarily as an intermediate in the production of PVB, which is a plastic laminate used as an adhesive between panes of automotive safety glass or load-resistant architectural glass.  PVA is also sold to end users (and occasionally to distributors) for use in the textile and paper industries in sizing formulations(such as PVA 098-08 & PVA 1099); as a binder in adhesive and soil binding formulations（such as PVA 088-20 & PVA 1788); and as an emulsion or polymerization aid in colloidal suspensions, water-soluble films, cosmetics, and joint compounds (such as KURARAY POVAL 17-94). 

Although different grades of PVA have differences in specific applications, the committee believes that all PVAs with a degree of hydrolysis exceeding 80% should be considered as the same type of product. This decision is based on three main points: first, all types of PVA share the same basic chemical makeup; second, different grades of PVA can be swapped for each other in many cases; and third, the way they are made and the materials used are pretty similar. It's important to note that while end users tend to stick to one specific grade of PVA to keep costs down, this habit doesn't change the fact that the product itself is quite uniform.

In this review, the Commission stuck with the product definition from the original investigation for two reasons: major manufacturers like Celanese and DuPont agreed with it, and the market hasn’t changed much since then. This decision also continues the Commission's position in the original investigation, that is, not to classify PVB-grade PVA into different product categories.

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Compatibility

The compatibility of Butvar polyvinyl butyral resins (PVB) with various plasticizers, modifiers, and additional resins is extensively documented. Butvar is readily amenable to compounding with other additives to improve its physical and chemical characteristics. Plasticizers are frequently utilized to enhance flexibility across a wider temperature spectrum, as noted in Table 9.

Crosslinking agents, including Santolink phenolic and Resimene amino resins, are employed to provide superior toughness and thermal stability. The compatibility of Butvar polyvinyl butyral resins (Butvar B-98 &  PVB WWW-A-20) with other modifiers and resins is illustrated in Table 10.

Insolubilizing Reactions

Numerous applications of vinyl acetal resins involve curing processes that utilize thermosetting resins to achieve the desired property balance. The free hydroxyl groups present in vinyl acetal resins serve as reactive sites for chemical interaction, allowing for the insolubilization of the resins. Generally, any chemical reagent or resinous material capable of reacting with secondary alcohols will interact with polyvinyl butyral (Butvar B-76 & WWW-A-30) to reduce its solubility. The characteristics of coatings can vary significantly depending on the type and quantity of crosslinking agents employed.

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Polyvinyl Butyral Resin (PVB) resin has become a popular high-performance material in industrial applications due to its excellent adhesion, flexibility and chemical adjustability. Especially in the field of insulating paint and surface coating, its unique hydroxyl active group gives it excellent adhesion, cross-linking ability and compatibility with a variety of resins, which can not only meet the stringent electrical performance requirements, but also provide a strong and durable protective coating. Whether as an insulating coating for electromagnetic wires or as a key component of multifunctional surface coatings, Butvar PVB has demonstrated its cross-domain adaptability and established its long-term leading position in the industry.

Wire enamels

Butvar resins ( Butvar B-98 & PVB WWW-A-20) may be used to overcoat magnet wire so that coils made from that wire can be cemented with heat or by solvent activation. Magnet wire that is coiled or formed, featuring a polyvinyl butyral coating, exhibits significant durability and flexibility. The hydroxyl functional groups within the polyvinyl butyral structure enable it to not only form crosslinks with itself but also to engage in cross-curing with phenolic or isocyanate resins. The comprehensive equilibrium of both physical and chemical characteristics has established Butvar-based overcoats as a predominant choice in the industry for an extended period.

Surface coatings

Butvar resin (Butvar B-76 &  PVB WWW-A-30) can be utilized either independently or in conjunction with various resins to create effective surface coating formulations. Films which may be air dried, baked, or cured at room temperature are obtained by proper compounding. The incorporation of hydroxyl groups within the polymer structure not only facilitates effective wetting of various substrates but also provides a reactive site for chemical interaction with thermosetting resins.

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With the rise and application of power devices, especially third-generation semiconductors, semiconductor devices are gradually evolving toward high power, miniaturization, integration, and multifunctionality. This places higher demands on the performance of packaging substrates. Ceramic substrates, with their high thermal conductivity, excellent heat resistance, low thermal expansion coefficient, high mechanical strength, good insulation, corrosion resistance, and radiation resistance, are widely used in electronic device packaging.

So, between aluminum nitride (AlN) and silicon nitride (Si₃N₄), which is the most promising packaging material?

Requirements for Ceramic Substrate Materials

1、High thermal conductivity to meet heat dissipation needs.

2、Excellent heat resistance for high-temperature applications (above 200°C).

3、Matching thermal expansion coefficient to reduce thermal stress between the chip and substrate.

4、Low dielectric constant for high-frequency performance, reducing signal delay and improving transmission speed.

5、High mechanical strength to withstand mechanical demands during packaging and application.

6、Good corrosion resistance to endure strong acids, alkalis, boiling water, and organic solvents.

7、Dense structure to meet hermetic packaging requirements for electronic devices.

Silicon Nitride (Si₃N₄)

Si₃N₄ ceramic substrates have an elastic modulus of 320 GPa, a flexural strength of 920 MPa, a thermal expansion coefficient of only 3.2 × 10⁻⁶/°C, and a dielectric constant of 9.4. They exhibit high hardness, strength, low thermal expansion, and excellent corrosion resistance.

Initially, due to the complex crystal structure of Si₃N₄, which causes significant phonon scattering, its thermal conductivity was considered low (15–30 W/(m·K)), making it suitable only for applications like bearing balls and structural components. However, research later revealed that the low thermal conductivity was mainly due to lattice defects and impurities, and it was predicted that its theoretical thermal conductivity could reach up to 320 W/(m·K). Subsequent studies optimized the manufacturing process, significantly improving the thermal conductivity of Si₃N₄ ceramics, which has now reached 177 W/(m·K).

Additionally, compared to other ceramic materials, Si₃N₄ exhibits outstanding advantages, particularly in high-temperature environments, where it demonstrates excellent thermal stability, chemical inertness to metals, ultra-high hardness, and fracture toughness. The flexural strength and fracture toughness of Si₃N₄ ceramics are more than twice those of AlN, making Si₃N₄ substrates far superior in reliability.

Aluminum Nitride (AlN)

AlN is one of the few materials that combines high thermal conductivity with excellent electrical insulation.

Its advantages include:

High thermal conductivity—Theoretical thermal conductivity at room temperature can reach up to 320 W/(m·K), 8–10 times that of alumina ceramics. In practice, its thermal conductivity can reach 200 W/(m·K), facilitating heat dissipation in LEDs and improving performance.

Low thermal expansion coefficient—Theoretical value is 4.6 × 10⁻⁶/K, close to that of commonly used LED materials like Si and GaAs. Its thermal expansion behavior is also similar to that of Si. Additionally, AlN has a lattice structure matching that of GaN, which is crucial for high-performance power LEDs.

Wide bandgap (6.2 eV)—Excellent insulation properties eliminate the need for additional insulation treatment in high-power LED applications, simplifying the process.

High hardness and strength—Due to its wurtzite structure and strong covalent bonds, AlN exhibits good mechanical properties. It also has excellent chemical stability and high-temperature resistance, remaining stable in air up to 1000°C and in vacuum up to 1400°C, making it suitable for high-temperature sintering and corrosion-resistant applications.

Conclusion

Among existing ceramic substrate materials, Si₃N₄ has the highest flexural strength and wear resistance, making it the best in terms of comprehensive mechanical properties. Its extremely low thermal expansion coefficient also makes it a highly promising material for power device packaging. However, its complex manufacturing process, high cost, and relatively low thermal conductivity limit its use to applications requiring high strength but moderate heat dissipation.

On the other hand, AlN excels in almost all aspects, particularly in thermal conductivity, which is crucial for electronic packaging. The main drawback is its high cost due to expensive raw materials and processing. However, as AlN production technology advances, costs are expected to decrease, paving the way for widespread adoption in high-power LED applications.

Which material do you think will dominate the future of high-power electronics?

About Xiamen Juci Technology

As the top aluminum nitride (AlN) powder manufacturer in China, Xiamen Juci Technology specializes in high-purity, high-performance AlN materials for advanced electronic applications. Our AlN powder and ceramics deliver exceptional thermal conductivity (up to 200 W/m·K), superior electrical insulation, and outstanding mechanical strength, making them ideal for high-power electronics, semiconductor packaging, LED cooling, and next-generation 5G/EV systems.

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Aluminum nitride (AlN) ceramics are widely used in electronic packaging and heat dissipation due to their excellent thermal conductivity. However, impurities and sintering conditions significantly affect their performance. This article discusses key approaches to improving AlN's thermal conductivity, including powder purification, sintering aids, process optimization, and prolonged sintering.

(1) Controlling the Quality of AlN Powder and Reducing Oxygen Impurity Content

Improving the synthesis method of AlN powder to produce high-purity powder with a particle size below 1 μm and an oxygen content of 1% is a prerequisite for preparing high-thermal-conductivity AlN ceramics. Additionally, for AlN powder containing sintering aids, introducing an appropriate amount of carbon can reduce and carburize the oxides on the AlN powder surface during the sintering process before densification, thereby enhancing the thermal conductivity of AlN ceramics. From this perspective, AlN powder prepared by the carbothermal reduction method may be more conducive to improving the thermal conductivity of AlN ceramics.

(2) Selecting Appropriate Types and Amounts of Sintering Additives

Extensive research has shown that rare-earth metal oxides and fluorides, alkaline-earth metal oxides and fluorides, etc., can serve as sintering aids to improve the thermal conductivity of AlN. Sintering aids react with alumina in AlN to form aluminate liquid phases, facilitating liquid-phase sintering and densification of the green body. On the other hand, sintering aids can reduce the oxygen content in the AlN lattice while enhancing contact between AlN particles, thereby improving thermal conductivity. However, the amount of additives must be appropriate—excessive amounts increase impurity content and impair thermal conductivity, while insufficient amounts fail to serve as effective sintering aids. As mentioned earlier, recent studies have shown that composite additives are more effective than single additives in enhancing thermal conductivity while also lowering the sintering temperature.

The effectiveness of additives in improving thermal conductivity has been confirmed by numerous experiments. Introducing suitable additives is currently a widely adopted method. However, there is no unified conclusion regarding the selection and combination of additives, their optimal amounts, or the methods of addition, necessitating further in-depth and systematic exploration.

(3) Optimizing Sintering Processes

For AlN ceramics, slow heating during sintering is more advantageous than rapid heating, as it not only reduces deformation but also improves the densification of the green body, thereby enhancing the performance of AlN ceramics.

The sintering process also involves an optimal sintering temperature. If the temperature is too high, excessive grain growth occurs, the grain boundary phase increases, and densification decreases, negatively impacting thermal conductivity.

Appropriately extending the sintering time can further purify the crystal lattice, promote grain growth, and significantly reduce porosity, thereby increasing thermal conductivity.

Generally, sintering in a reducing atmosphere under nitrogen protection can reduce oxygen impurities in AlN through carbothermal nitridation and reduction, which is beneficial for improving thermal conductivity. Pressure sintering significantly enhances the sintering performance of AlN and reduces the amount of sintering aids required. Increasing pressure improves the densification of AlN, all of which contribute to better performance of AlN ceramics. Additionally, the powder-bed method also affects the thermal conductivity of AlN ceramics.

(4) Prolonging Sintering Time

In addition to introducing sintering aids and optimizing sintering processes, extending the sintering time can also improve the thermal conductivity of AlN ceramics. For example, annealing in a reducing atmosphere can remove oxygen and secondary phases from AlN. Nakano et al. used a similar method, heat-treating sintered AlN (with Y₂O₃) in a reducing nitrogen atmosphere at 1900°C. After 20 hours, the thermal conductivity reached 220 W/m·K, and after 100 hours, it increased to 272 W/m·K.

About Xiamen Juci Technology

Juci Technology, with its high-purity raw materials, composite additive technology, precise sintering process and flexible customization capabilities, has become one of the few domestic enterprises capable of stably mass-producing high thermal conductivity AlN ceramics, especially suitable for the demands of high-end fields such as high-power leds, IGBT modules and aerospace.

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Aluminum Nitride (AlN) possesses a series of excellent properties, with its core advantages including outstanding thermal conductivity, reliable electrical insulation, and a thermal expansion coefficient that matches silicon. In which fields can it be applied?

1、Heat Dissipation Substrates and Electronic Device Packaging

Heat dissipation substrates and electronic device packaging are the primary applications of AlN ceramics. AlN ceramics exhibit exceptional thermal conductivity, a thermal expansion coefficient close to that of silicon, high mechanical strength, good chemical stability, and are environmentally non-toxic. They are regarded as ideal materials for the next generation of heat dissipation substrates and electronic device packaging. They are particularly suitable for hybrid power switch packaging, microwave vacuum tube encapsulation shell materials, and are also an ideal substrate material for large-scale integrated circuits.

2、Structural Ceramics

A common application of structural ceramics is in electrostatic chucks for wafer processing. AlN structural ceramics offer excellent mechanical properties, high hardness, and better toughness than Al₂O₃ ceramics, along with high-temperature and corrosion resistance. Leveraging AlN's heat and erosion resistance, it can be used to manufacture high-temperature corrosion-resistant components such as crucibles, Al evaporation dishes, and semiconductor electrostatic chucks.

3、Functional Materials

AlN can be used to produce high-frequency, high-power devices capable of operating in high-temperature or radiation-prone environments, such as high-power electronic devices and high-density solid-state memory. As one of the third-generation semiconductor materials, AlN boasts a wide bandgap, high thermal conductivity, high resistivity, excellent UV transmittance, and high breakdown field strength.

With a bandgap of 6.2 eV and strong polarization effects, AlN finds applications in mechanical, microelectronic, optical, and surface acoustic wave (SAW) device manufacturing, as well as high-frequency broadband communication. Examples include AlN piezoelectric ceramics and thin films. Additionally, high-purity AlN ceramics are transparent, offering excellent optical properties. Combined with their electrical properties, they can be used to create functional devices such as infrared radomes and sensors.

4、Inert Heat-Resistant Materials

As a heat-resistant material, AlN can be used for crucibles, protective tubes, casting molds, and more. AlN remains stable in non-oxidizing atmospheres up to 2000°C, making it an excellent high-temperature refractory material with strong resistance to molten metal erosion.

5、Heat Exchange Components

AlN ceramics feature high thermal conductivity, low thermal expansion coefficient, and excellent thermal efficiency and thermal shock resistance, making them ideal materials for heat exchange and thermal shock resistance. For example, AlN ceramics can serve as heat exchanger materials for marine gas turbines and heat-resistant components in internal combustion engines. The superior thermal conductivity of AlN materials significantly enhances the heat transfer efficiency of heat exchangers.

6、Filler Materials

AlN exhibits excellent electrical insulation, high thermal conductivity, good dielectric properties, and compatibility with polymer materials, making it an outstanding additive for electronic polymer materials. It can be used as a filler for thermal interface materials (TIM) and flexible copper-clad laminate (FCCL) dielectric layers, widely applied as a thermal transfer medium in electronic devices to improve efficiency. Examples include filling gaps between CPUs and heat sinks, or acting as a thermal transfer medium in the fine gaps between high-power transistors, thyristors, and substrates.

About Xiamen Juci Technology

Xiamen Juci Technology is the leading AlN powder manufacture in China. Our  AlN products feature excellent thermal conductivity, electrical insulation, and mechanical strength, widely used in electronic packaging, semiconductors, LED heat dissipation, and other fields. Juci Technology specializes in manufacturing high-performance aluminum nitride heat sinks and aluminum nitride ceramic substrates, providing leading solutions for electronic heat dissipation.

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Choline alfoscerate (α-GPC; alpha GPC; L-alpha glycerylphosphorylcholine; CAS No.:28319-77-9) is common choline compound and acetycholine precursor in the brain, which has been shown to be effective in the treatment of Alzheimer’s disease and dementia. α-GPC has been shown to enhance memory and cognitive function in stroke and Alzheimer’s patients but currently remains untested in patients suffering from epilepsy. This study aimed to evaluate whether α-GPC treatment after seizure can ameliorate seizure -induced cognitive impairment and neuronal injury.

The potential therapeutic effects of α-GPC on seizure-induced cognitive impairment were tested in an animal model of pilocarpine-induced seizure. Seizures were induced by intraperitoneal injection of pilocarpine (25 mg/ kg) in male rats. α-GPC (250 mg/kg) was injected into the intramuscular space once daily for one or three weeks from immediately after seizure, or from 3 weeks after the seizure onset for 3 weeks. Here we found that immediate 1-week treatment of α-GPC showed no neuroprotective effects and neurogenesis. Immediate 3-week treatment of α-GPC showed neuroprotective effect but no effect on neurogenesis. To evaluate the effect of late treatment of α-GPC on cognitive impairment following seizure, rats were injected α-GPC from 3 weeks after seizure for 3 weeks and subjected to a water maze test. In the present study, we found that administration of αGPC starting at 3 weeks after seizure improved cognitive function through reduced neuronal death and BBB disruption, and increased neurogenesis. Therefore, α-GPC injection may serve as a beneficial treatment for

improvement of cognitive function in epilepsy patients.

Reference:

Late treatment with choline alfoscerate (L-alpha glycerylphosphorylcholine, α-GPC) increases hippocampal neurogenesis and provides protection against seizure-induced neuronal death and cognitive impairment

Song Hee Lee, Bo Young Choi, Jin Hee Kim, A.Ra Kho, Min Sohn, Hong Ki Song,Hui Chul Choi
, Sang Won Suha
Department of Physiology, Hallym University, College of Medicine, Chuncheon, Republic of Korea
Department of Neurology, Hallym University, College of Medicine, Chuncheon, Republic of Korea

Inha University, Department of Nursing, Incheon, Republic of Korea
Hallym Institute of Epilepsy Research, Hallym University, College of Medicine, Chuncheon, Republic of Korea

Sinoway is a professional alpha-GPC supplier, we can supply you alpha GPC with 99.7% up, single impurity below 0.1%, Food Grade, Pharma Grade, 100% pass 80 mesh. Please feel free to contact china-sinoway for the more details.

Phenylmethane bismaleimide BMI-200 (Other name:BMI-2300) ,CAS 67784-74-1) manufactured by Yangchen Tech is a high-performance thermoset resin for demanding aerospace, electronics, adhesives and composite applications. It is an aromatic bismaleimide (BMI) resin known for its excellent thermal stability, mechanical strength and chemical resistance. BMI-200 is typically supplied as a tan crystalline powder and cures to form a hard glassy network with a very high glass transition temperature (typically >250°C) and very low volatile by-products.

Physical Properties

• Appearance and physical properties: tan crystalline powder (softening point ≈83°C; melting point ≈150-160°C). Density ≈1.22ghttps://www.yangchentech.comcm³. Very low volatile matter content (<1%).
• Thermal properties: Glass transition temperature ~287°C (DMA); maintains integrity above 250°C. 5% weight loss at around 408°C indicates excellent heat resistance. BMI-2300 cures by addition (Michaelhttps://www.yangchentech.comene reaction) with no volatile byproducts.
• Mechanical properties: High flexural strength (about 204MPa at room temperature) and stiffness (flexural modulus about 4.4GPa at room temperature). Barcol hardness about 59. High modulus and strength are maintained at elevated temperatures.
• Electrical properties: Dielectric constant ≈ 3.1, loss tangent ≈ 0.012 (GHz frequency), making it ideal for high-speedhttps://www.yangchentech.comhigh-frequency electronic devices. High insulation resistance and low dielectric loss.
• Chemical properties: Acid value about 2.4mgKOHhttps://www.yangchentech.comg. Excellent resistance to solvents, fuels, and moisture. Insoluble in non-polar solvents (e.g. toluene), but soluble in highly polar aprotic solvents (THF, DMF, MEK).

   

  Technical Indicators

   

  Appearance	Softening point	Acid value	Solubility
  Brownish-yellow lumps	60-120℃	＜10	50% transparent solution (ketone solvent)   Solubility   Solvent ACETONE MEK THF DMF NMP TOLUENE Phenylmethane bismaleimide 50-80 60-80 20-100 ＜80 ＜50 Insoluble     Benefits of Phenylmethane bismaleimide  BMI-200   Exceptional Thermal Stability: Maintains structural integrity well above 250°C (glass transition ~287°C). Minimizes discoloration and degradation in high-temperature service. Ideal for jet-engine components, turbine parts and high-speed electronic devices. High Mechanical Performance: High modulus and strength even at elevated temperatures. Improves stiffness and fatigue life of composite parts. Resists deformation under load, enhancing reliability of structural laminates and housings. Chemical & Environmental Resistance: Aromatic imide backbone provides excellent resistance to fuels, solvents, acids and moisture. Enables long-term stability in aviation fuels, hydraulic fluids, and corrosive environments. Low moisture uptake improves dimension stability in humid conditions. Electrical & Dielectric Advantages: Low dielectric constanthttps://www.yangchentech.comloss makes BMI-2300 ideal for RFhttps://www.yangchentech.commicrowave circuit boards and high-voltage insulation. Ensures signal integrity and insulation strength in harsh environments. High Tg also raises the operating temperature of laminates, improving thermal cycling reliability. Manufacturing Reliability: Cures via addition chemistry without evolving gases, so parts have minimal voiding or blistering. Improves bond adhesion (e.g. to copper foil in PCBs) and composite consolidation. Reduces processing defects compared to condensation thermosets. Lightweight, Flame-Resistant: Enables weight reduction in aerospacehttps://www.yangchentech.comelectronics versus metal alternatives while providing inherent flame retardancy (aromatic structures are self-extinguishing). Helps OEMs meet stringent FARhttps://www.yangchentech.comFMVSS fire, smoke and toxicity requirements.      What is Polyimide resin Powder used for? 2025-06-12 polyimide resin powder, polyimide resin suppliers Polyimide resin Powder manufactured by Yangchen Tech plays a critical role in advanced friction materials by serving as the high-performance binder or matrix that holds together reinforcing fibers and fillers. Its outstanding thermal stability, wear resistance, and ability to maintain a stable coefficient of friction under changing loads and temperatures make it an ideal replacement for conventional phenolic systems in demanding applications.     High-Temperature Resistance & Thermal Stability Friction interfaces—such as brake pads and clutch plates—can reach temperatures above 300 °C during heavy or repeated braking. Polyimide resin maintains mechanical integrity and frictional properties at these temperatures, preventing “fade” (loss of braking performance) and extending service life.  Abrasion & Wear Resistance The inherently high hardness and chemical resistance of polyimide help reduce material loss under sliding contact. Composites formulated with polyimide binders show lower wear rates compared to phenolic-based friction materials, translating to longer intervals between replacements.  Stable Coefficient of Friction Polyimide-based composites exhibit minimal variation in friction coefficient across a wide temperature range, ensuring predictable braking or clutch engagement without judder, chatter, or noise. Modifications—such as adding graphite or ceramic fillers—can further tune friction levels for specific applications.  Applications Automotive & Heavy-Duty Brakes: Pads and linings for performance vehicles, trucks, and off-road equipment that demand high fade resistance. Aerospace Brake Systems: Carbon-carbon or carbon-ceramic discs often use polyimide matrix composites for landing-gear and wheel brakes, where weight savings and thermal endurance are paramount. Industrial Machinery: Clutches and brakes in stamping presses, mining equipment, and wind-power generators benefit from the resin’s durability under high loads. Grinding Wheels & Cutting Tools: As a binder for superabrasive (diamond, CBN) wheels, polyimide delivers improved wheel life and cutting consistency at elevated operating temperatures. Processing & Fabrication Typical manufacturing methods include hot molding, cold/hot isostatic pressing, and even advanced techniques like injection molding or 3D printing of pre-ceramic precursors. These processes allow precise control of resin/filler ratios and part geometry.    When you need friction materials that can withstand extreme heat, deliver consistent braking performance, and offer superior wear life, polyimide resin — often filled with fibers (e.g., aramid, carbon) and solid lubricants (e.g., graphite, MoS₂) — is the binder of choice for next-generation brake pads, clutch facings, industrial brakes, and superabrasive tools.